๐๐๐๐๐ ๐ข๐จ๐ง ๐ข๐จ๐ฅ ๐๐๐ง๐๐ฆ๐ง ๐ฃ๐จ๐๐๐๐ฆ๐๐๐ ๐๐ฅ๐ง๐๐๐๐
Electronic packaging cabinets simplified modeling, simulation, and experimental validation for systems engineering
https://journals.sagepub.com/doi/10.1177/00375497211069979
In this paper, published in ๐ฆ๐ถ๐บ๐๐น๐ฎ๐๐ถ๐ผ๐ป 2022 (SAGE JOURNALS - Impact factor = 1.377), we describe a simplified three-dimensional mathematical model for electronic packaging cabinets. The model can help new developments from emerging technologies respecting the growing demand for high power density (high power and small size) in power electronics. We presented a system mathematical modeling followed by model adjustment and experimental validation. Finally, we show a heat source height optimization form maximum heat transfer rate or minimum hot spot temperature. This paper were a collaboration between researches from Florida State University and Universidade Federal do Paranรก (Programa de Pรณs-Graduaรงรฃo em Engenharia e Ciรชncia dos Materiais, PGMEC, DELT, DEMEC) funding by CNPq - Conselho Nacional de Desenvolvimento Cientรญfico e Tecnolรณgico, CAPES - Coordenaรงรฃo de Aperfeiรงoamento de Pessoal de Nรญvel Superior, PRONEX and Fundacao Araucaria (Brazil).
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